PCB Design Services

PCB Design Service

Product Engineering

A brand-new product concept?

The PCB design & layout services offered by the technical team at Rantronics will be of the greatest calibre. We provide more than just a universally applicable answer. Before we start designing a PCB, we thoroughly analyze its requirements and purpose to make sure it is cost-efficient, functional, and designed for manufacture.

Design for Manufacturability

Design for Environment

Cost-Effective Design

Turnkey Development

Experienced In-house Engineering Team

Industrial applications

Industrial Electronics

Mobile and Telecommunication

Consumer Electronics

Medical

RF Design

Analog Design

Aerospace

Semiconductor

Automotive

Technology Proficiency

Ethernet 10G Over Backplane

PCIe Switches / Controllers

IB and BXI offset 11.3 angle routing

Noise reduction techniques and emission of heat control.

Flex and Rigid PCB

1/10G Line Card , Bluetooth, Ethernet &Wi- Fi.

SERDES, SRIO, GPS & RF.

PCI Express, PCI Express 2.0, PCI Express 3.0

ADC and DAC converter.

Handled Up to 100 Gbps DDR2,3&4, QDR, SRAM, LPDDR.

PXIE, QPI, IB and BXI.

HDMI, SATA, SGMII, USB

USB, SATA Gen1/2/3, HDMI

PCI Express Gen2/3/4

DDR4/3/2, RLDRAM, QDR, LPDDR4/3

CHIPSET IMPLEMENTATION

Xilinx 5, 6 and 7 Series (Kintex, Virtex, Artix)

RZ/G Series (Cortex-A53)

Xilinx UltraScale and UltraScale+ FPGAs

Xilinx Zynq UltraScale+ MPSoC

Design Capabilities

Back drill, Blind and Buried vias.

Design support for DFA, DFM & DFT.

DFA & DFM support for Penalization.

Layer stack-up building support for high speed design.

Proper analysis of component placement mixed layout (Analog, Digital & Power supply).

Well Rule setup for Design.

Feasibility Analysis for product development time allocation.

Data base Library management and development. (Fine pitches components BGA, LGA, QFN, PQFP and etc.)

Physical PCB analysis for Reverse Engineering (Single & Double layer).

Controlled impedance and proper Analysis.

Our Design process

PCB Projects

NETWORK BASED PROJECT

Board Size : 160 x 230mm Layers : 24 No of Components : 1264 Total Nets : 1658 Total Connections : 4972 PCB Thickness : 1.8mm Material : FR4 Via : Micro, Blind & Buried with staggered Via. Back Drill Technology : Yes Min Trace width : 4 mils Min Spacing : 4 mils Impedance : Yes High speed Interfaces : 0.5mm pitch 1152 pins & 1mm pitch , 484 pins FBGA , DDR4, PCIe4, USB3, VME Connector 160 pins and PMIC section’s

CPU BASED PROJECT

Board Size : 180 x 160mm Layers : 22 No of Components : 1359 Total Nets : 1083 Total Connections : 5935 PCB Thickness : 2mm Material : FR4 Via : Micro, Blind & Buried with stacked Via. Back Drill Technology : Yes Min Trace width : 3.5 mils Min Spacing : 4 mils Impedance : Yes High speed Interfaces : 0.35mm pitch FBGA (Processor), DDR4, PCIe4, USB3, SATA, RJ45, Hirose Connector and PMIC section’s

PCIe NVMe SSDs

Board Size: 95 x 95 mm Layers: 22 No of Components: 1101 Total Nets: 765 Total Connections: 4559 PCB Thickness: 2.099mm Material: FR4 Via: BB Via, Through Hole Via Back Drill Technology: Yes Min Trace width: 2.83 mils Min Spacing: 3 mils Major Components: FCBGA_

MIS500-CIU-SoM

Board Size: 67 x 65 mm Layers: 16 No of Components: 331 Total Nets: 431 Total Connections: 1466 PCB Thickness: 2.099 mm Material: FR4 Via: BB Via, Through Hole Via Back Drill Technology: Yes Min Trace width: 2.15 mils Min Spacing: 3.5 mils Major Components: 784_FCBGA_Cortex, 200-TFBGA_DDR4 8 bit parallel, Ethernet FBGA_152, PCIe Connector-4

Storage and Networking

Board Size: 64 x 97 mm Layers: 22 No of Components: 1061 Total Nets: 773 Total Connections: 4119 PCB Thickness: 2.099 mm Material: FR4 Via: BB Via, Through Hole Via Back Drill Technology: Yes Min Trace width: 2.15 mils Min Spacing: 3.5 mils Major Components: FCBGA_1760 INTEL, 64 bit_DDR4, 16_Nand Flash Memory Connector, PCIe Gen4, Ethernet, UCB 3.0, Buck Booster, PMIC connector, and etc.